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Comparative study of thermal cycling and thermal shocks tests on electronic components reliability


Publisher
Elsevier Science
Year
2004
Tongue
English
Weight
978 KB
Volume
44
Category
Article
ISSN
0026-2714

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โœฆ Synopsis


In this work, the first reliability results of Thermal Cycling Tests (TCT, air-air test) and Thermal Shock Tests (TST, liquidliquid test) on medium power electronic components are discussed. The influence of dwell times, extremes temperatures and mean temperature is investigated. This study is based on statistical data correlated with information coming from failure analysis and confirmed by a basic FEM analysis.

(C) 2004 Elsevier Ltd. All rights reserved.


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