Comparative study of thermal cycling and thermal shocks tests on electronic components reliability
- Publisher
- Elsevier Science
- Year
- 2004
- Tongue
- English
- Weight
- 978 KB
- Volume
- 44
- Category
- Article
- ISSN
- 0026-2714
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โฆ Synopsis
In this work, the first reliability results of Thermal Cycling Tests (TCT, air-air test) and Thermal Shock Tests (TST, liquidliquid test) on medium power electronic components are discussed. The influence of dwell times, extremes temperatures and mean temperature is investigated. This study is based on statistical data correlated with information coming from failure analysis and confirmed by a basic FEM analysis.
(C) 2004 Elsevier Ltd. All rights reserved.
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