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A Study of the Shear Response of a Lead-Free Composite Solder by Experimental and Homogenization Techniques

โœ Scribed by V. Sivasubramaniam; M. Galli; J. Cugnoni; J. Janczak-Rusch; J. Botsis

Book ID
107455584
Publisher
Springer US
Year
2009
Tongue
English
Weight
900 KB
Volume
38
Category
Article
ISSN
0361-5235

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โœ X.P. Zhang; C.B. Yu; Y.P. Zhang; S. Shrestha; L. Dorn ๐Ÿ“‚ Article ๐Ÿ“… 2007 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 231 KB

In this study, the processing performance of a lead-free Sn-Ag-Cu-Bi solder after rapid laser-beam reflowing was investigated, and the creep behaviors of the soldered joints were evaluated under different homologue temperatures from 0.68 to 0.82, with a systematical comparison to that of a Sn60Pb40