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A study of failure of SMT solder joints under thermal cycles by statistics

✍ Scribed by J.H. Huang

Publisher
Elsevier Science
Year
1992
Tongue
English
Weight
255 KB
Volume
32
Category
Article
ISSN
0026-2714

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πŸ“œ SIMILAR VOLUMES

Failure prediction of a plate weakened b
Failure prediction of a plate weakened by an elliptic hole under thermal or mechanical load
✍ C.K. Chao; J.L. Wang πŸ“‚ Article πŸ“… 1993 πŸ› Elsevier Science 🌐 English βš– 922 KB

The failure initiation and crack trajectory are predicted for a plate weakened by an elliptic hole under thermal or mechanical load. The closed form solutions are obtained by using the complex variable theory and the fracture behavior is predicted by applying the strain energy density criterion. The