Abstract
The present study uses a heat sink plate to conduct natural convection in order to examine different areas of the heat sink and the effects of mounting different quantities of LEDs on the same surface on the thermal mechanism performance. Based on the experimental results, when a heat sink plate is arranged vertically, the channel flow between the fins is parallel to gravity. The LED substrate plate temperature is different from that at the end of the fin, and rises with the increase of total power. The thermal resistance rises slowly and then declines with the increase of LED electric power. As for temperature change of the LED substrate and at the end of the fin, when the temperature difference is increased, it also increases the natural convection thrust. For thermal resistance, the environmental thermal resistance at the bottom of the heat sink plate is lower than at the middle and top sections. These LED power emissions will be changed synchronously.
Regarding the LED quantity control, the rate of increase is the highest for the heat sink plate with 30 pcs LED, and the temperature is very high for the heat sink plate with 45 and 60 pcs LEDs when the power approaches 1 W. Moreover, the rising rate is the lowest for the heat sink plate with 60 pcs LEDs. Depending on the brightness requirement, the illuminant is provided by 60 pcs LEDs to obtain a lower temperature so that the system can reduce the thermal protective design. Evidence shows that a high conductivity heat pipe embedded in the channel can provide a more uniform temperature distribution. The present study provides a further understanding on the influence of different illuminant densities on the heat sink structure and the temperature difference in an LED heat transfer device, in order to provide a reference for heat sink design of a backlight module and LED illuminant module evaluation. ยฉ 2010 Wiley Periodicals, Inc. Heat Trans Asian Res; Published online in Wiley Online Library (wileyonlinelibrary.com). DOI 10.1002/htj.20321