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A silicon test chip for the thermomechanical analysis of MEMS packagings

✍ Scribed by Soeren Majcherek; Thomas Leneke; Soeren Hirsch


Publisher
Springer-Verlag
Year
2008
Tongue
English
Weight
576 KB
Volume
15
Category
Article
ISSN
0946-7076

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## Abstract A novel integrated‐circuit pressed‐ceramic package antenna is proposed for the single‐chip solution of a wireless transceiver. The antenna printed on a dual‐in‐line package is studied experimentally at 2.4 GHz. The results show that the antenna has achieved a bandwidth of 15.7% and a ga