✦ LIBER ✦
Integrated-circuit pressed-ceramic package antenna for the single-chip solution of a wireless transceiver
✍ Scribed by Y. P. Zhang; M. A. Do
- Publisher
- John Wiley and Sons
- Year
- 2001
- Tongue
- English
- Weight
- 115 KB
- Volume
- 30
- Category
- Article
- ISSN
- 0895-2477
- DOI
- 10.1002/mop.1305
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✦ Synopsis
Abstract
A novel integrated‐circuit pressed‐ceramic package antenna is proposed for the single‐chip solution of a wireless transceiver. The antenna printed on a dual‐in‐line package is studied experimentally at 2.4 GHz. The results show that the antenna has achieved a bandwidth of 15.7% and a gain of −2.0 dBi. © 2001 John Wiley & Sons, Inc. Microwave Opt Technol Lett 30: 330–332, 2001.