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A semi-analytical method to predict printed circuit board package temperatures

✍ Scribed by Funk, J.N.; Menguc, M.P.; Tagavi, K.A.; Cremers, C.J.


Book ID
114560364
Publisher
IEEE
Year
1992
Tongue
English
Weight
936 KB
Volume
15
Category
Article
ISSN
0148-6411

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A simple method for computing the crosstalk between parallel conductors on printed circuit boards is presented. The crosstalk is computed by using a lumped-circuit element model for the conductors, where the per unit-length parameters are computed by a finite-difference scheme. The method is applied