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A reliability study of barrier-metal-clad copper interconnects with self-aligned metallic caps

✍ Scribed by Saito, T.; Ashihara, H.; Ishikawa, K.; Miyauchi, M.; Yamada, Y.; Nakano, H.

Book ID: 114617637
Publisher: IEEE
Year: 2004
Tongue: English
Weight: 823 KB
Volume: 51
Category: Article
ISSN: 0018-9383
DOI: 10.1109/ted.2004.838512

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