✦ LIBER ✦
Fabrication of Cu(Ti) Alloy Interconnects with Self-Formation of Thin Barrier Metal Layers Using a High-Pressure Annealing Process
✍ Scribed by S. Tsukimoto; T. Onishi; K. Ito; M. Konno; T. Yaguchi; T. Kamino; M. Murakami
- Publisher
- Springer US
- Year
- 2007
- Tongue
- English
- Weight
- 277 KB
- Volume
- 36
- Category
- Article
- ISSN
- 0361-5235
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