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A novel transient simulation for 3D multilevel interconnections on complex topography

✍ Scribed by Hsin-Ming Hou; Chin-Shown Sheen; Ching-Yuan Wu

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

A novel modeling technique for efficient

✍ Hsin-Ming Hou; Chin-Shown Sheen; Ching-Yuan Wu 📂 Article 📅 1998 🏛 IEEE 🌐 English ⚖ 204 KB

An accurate model for the transient simu

✍ H.G. Brachtendorf; R. Laur 📂 Article 📅 2000 🏛 Elsevier Science 🌐 English ⚖ 322 KB

3-D ICs: a novel chip design for improvi

✍ Banerjee, K.; Souri, S.J.; Kapur, P.; Saraswat, K.C. 📂 Article 📅 2001 🏛 IEEE 🌐 English ⚖ 722 KB

A novel approach based on Simulated anne

✍ Lahiri, A.; Chakravorti, S. 📂 Article 📅 2005 🏛 IEEE 🌐 English ⚖ 538 KB

[IEEE IEEE International Conference on S

✍ Shao, X.; Goldsman, N.; Ramahi, O.; Guzdar, P.N. 📂 Article 📅 2003 🏛 IEEE 🌐 English ⚖ 704 KB

Velocity- and time-dependent transients

📂 Article 📅 1987 🏛 Elsevier Science 🌐 English ⚖ 116 KB 👁 3 views