A novel modeling technique for efficiently computing 3-D capacitances of VLSI multilevel interconnections-BFEM

✍ Scribed by Hsin-Ming Hou; Chin-Shown Sheen; Ching-Yuan Wu

• Book ID: 114537175
• Publisher: IEEE
• Year: 1998
• Tongue: English
• Weight: 204 KB
• Volume: 45
• Category: Article
• ISSN: 0018-9383
• DOI: 10.1109/16.658831