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A Method for Selective Deposition of Copper Nanoparticles on Silicon Surfaces

โœ Scribed by Choi, Jaeyoung; Chen, Zhan; Singh, Rajiv K.

Book ID
126562089
Publisher
The Electrochemical Society
Year
2003
Tongue
English
Weight
885 KB
Volume
150
Category
Article
ISSN
0013-4651

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Fabrication of fine copper lines by sele
Fabrication of fine copper lines by selective chemical vapor deposition on silicon substrates
โœ S. Vidal; A. Gleizes; D. Davazoglou ๐Ÿ“‚ Article ๐Ÿ“… 2001 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 771 KB

Fine copper lines, with a width of less than 1 mm, were fabricated on silicon substrates. For the fabrication, oxidized (100) silicon substrates were used, covered with a film grown by LPCVD at 0.1 Torr and 5508C from W(CO) decomposition. 6 These substrates were subsequently covered with AZ 5214E ph