A low-temperature thermosetting bis-maleimide resin
โ Scribed by L. R. Dix; M. A. Simpson; L. N. Ly
- Publisher
- John Wiley and Sons
- Year
- 1993
- Tongue
- English
- Weight
- 168 KB
- Volume
- 48
- Category
- Article
- ISSN
- 0021-8995
No coin nor oath required. For personal study only.
๐ SIMILAR VOLUMES
## Abstract **Summary:** Polymeric thermosetting composites can be used as metal substitutes for certain applications if they possess high temperature stability in air, low coefficient of thermal expansion (CTE), and sufficient flexural strength, in combination with competitive costs. Commercial bi
A nadimide end-capped thermosetting oligomer was modified by blending with three homologous soluble linear polyimides containing bulky lateral fluorene groups with the intention of improving its fracture toughness. These linear polyimides were prepared by polycondensation between 4,4ะ-(9H-fluoren-9-