Use of thermally stimulated discharge me
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J. H. Daly; K. Jeffrey; D. Hayward; R. A. Pethrick; P. Wilford
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Article
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1993
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Springer
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English
β 882 KB
Thermally stimulated discharge (TSD) measurements have been used to monitor the cure in thermoset resins and this paper attempts a critical assessment of its application to epoxy resin systems. These studies show that, whilst the method can be used for monitoring cure, there are problems concerned w