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Low temperature cure thermosetting polyamide resins


Publisher
Elsevier Science
Year
2009
Weight
102 KB
Volume
2009
Category
Article
ISSN
1364-5439

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Settling behavior of fillers in thermose
โœ Jiro Fukushima; Kazuo Yasuda; Hiroshi Teratani; Shunichiro Nishizaki ๐Ÿ“‚ Article ๐Ÿ“… 1978 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 736 KB

## Abstract Using a theory based on a modified Stokes' law equation, the settling behavior of fillers was investigated (glass beads and silica powder) in thermosetting epoxy casting resins during cure. In this study a suspension (a thermosetting epoxy casting resin) containing a large amount of fil