✦ LIBER ✦

A comparison of copper and gold wire bonding on integrated circuit devices

✍ Scribed by Khoury, S.L.; Burkhard, D.J.; Galloway, D.P.; Scharr, T.A.

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

A comparison of copper and gold wire bon

📂 Article 📅 1991 🏛 Elsevier Science 🌐 English ⚖ 130 KB

Effect of Circuit Parameters and Wire Pr

✍ Qing Zhou; Qiaogen Zhang; Jun Zhang; Junping Zhao; Lei Pang; Baozhong Ren 📂 Article 📅 2011 🏛 IEEE 🌐 English ⚖ 589 KB

Wideband characterization of a typical b

✍ Hai-Young Lee 📂 Article 📅 1995 🏛 IEEE 🌐 English ⚖ 626 KB

Effect of heat treatment on the shear st

✍ Tomlinson, W.J.; Winkle, R.V.; Blackmore, L.A. 📂 Article 📅 1990 🏛 IEEE 🌐 English ⚖ 471 KB

A comparison of the performance of plast

✍ M.J. Fox 📂 Article 📅 1977 🏛 Elsevier Science 🌐 English ⚖ 255 KB

Nasecode VII The seventh international c

📂 Article 📅 1991 🏛 Elsevier Science 🌐 English ⚖ 126 KB