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Wideband characterization of a typical bonding wire for microwave and millimeter-wave integrated circuits

✍ Scribed by Hai-Young Lee

Book ID: 114552203
Publisher: IEEE
Year: 1995
Tongue: English
Weight: 626 KB
Volume: 43
Category: Article
ISSN: 0018-9480
DOI: 10.1109/22.363006

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