✦ LIBER ✦
Effect of heat treatment on the shear strength and fracture modes of copper wire thermosonic ball bonds to Al-1% Si device metallization
✍ Scribed by Tomlinson, W.J.; Winkle, R.V.; Blackmore, L.A.
- Book ID
- 117872758
- Publisher
- IEEE
- Year
- 1990
- Tongue
- English
- Weight
- 471 KB
- Volume
- 13
- Category
- Article
- ISSN
- 0148-6411
- DOI
- 10.1109/33.58864
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