✦ LIBER ✦

4811082 High performance integrated circuit packaging structure

✍ Scribed by ScottL Jacobs; Perwai Nihal; Burhan Ozmat; Henri Schnurmann

Publisher: Elsevier Science
Year: 1989
Tongue: English
Weight: 77 KB
Volume: 29
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(89)90315-6

No coin nor oath required. For personal study only.

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