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4650696 Process using tungsten for multilevel metallization

โœ Scribed by Joseph Raby

Book ID
103282627
Publisher
Elsevier Science
Year
1987
Tongue
English
Weight
91 KB
Volume
27
Category
Article
ISSN
0026-2714

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X-ray photoelectron spectroscopy was used to assess the interaction of evaporated and sputter-deposited copper with Teflon AFI600. Both evaporation and sputtering caused defluorination, graphitization and crosslinking of the carbon chains, as well as the formation of Cu-C bonds and C-O" free radical