✦ LIBER ✦
Copper metallization of Teflon AF1600, using evaporation and sputtering, for multilevel interconnect devices
✍ Scribed by D. Popovici; J.E. Klemberg-Sapieha; G. Czeremuszkin; E. Sacher; M. Meunier; L. Martinu
- Book ID
- 104306213
- Publisher
- Elsevier Science
- Year
- 1997
- Tongue
- English
- Weight
- 261 KB
- Volume
- 33
- Category
- Article
- ISSN
- 0167-9317
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✦ Synopsis
X-ray photoelectron spectroscopy was used to assess the interaction of evaporated and sputter-deposited copper with Teflon AFI600. Both evaporation and sputtering caused defluorination, graphitization and crosslinking of the carbon chains, as well as the formation of Cu-C bonds and C-O" free radicals. Additionally, the higher energies of the sputter-deposited copper atoms led to a loss of oxygen and to the total reaction of the deposited copper as carbide and fluorides.