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Wafer edge surface inspection patent


Publisher
Elsevier Science
Year
2005
Tongue
English
Weight
82 KB
Volume
18
Category
Article
ISSN
0961-1290

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Industrial practise in wafer manufacturing indicates that there is not one agreed method available to acquire a conclusive picture of the sub-surface damage, defined as structural inhomogeneities of the crystal lattice. Therefore, various methods have been studied and compared for measurement of the