𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Volume and surface self-diffusion measurements on copper by thermal surface smoothing

✍ Scribed by Hoehne, K. ;Sizmann, R.

Book ID
105366962
Publisher
John Wiley and Sons
Year
1971
Tongue
English
Weight
687 KB
Volume
5
Category
Article
ISSN
0031-8965

No coin nor oath required. For personal study only.

πŸ“œ SIMILAR VOLUMES

Self-diffusion processes of copper adato
Self-diffusion processes of copper adatom on Cu(110) surface by molecular dynamics simulations
✍ G.A. Evangelakis; D.G. Papageorgiou; GC Kallinteris; ChE Lekka; NI Papanicolaou πŸ“‚ Article πŸ“… 1998 πŸ› Elsevier Science 🌐 English βš– 473 KB

The self-diffusion mechanisms of single adatoms on the Cu(l70) surface have been studied using molecular dynamics simulation and a many-body potential within the second-moment approximation of the tightbinding model. From a detail trajectory analysis we found a variety of diffusion mechanisms, the h

Diffusion Barrier Deposition on a Copper
Diffusion Barrier Deposition on a Copper Surface by Atomic Layer Deposition
✍ K.-E. Elers; V. Saanila; P. J. Soininen; W.-M. Li; J. T. Kostamo; S. Haukka; J. πŸ“‚ Article πŸ“… 2002 πŸ› John Wiley and Sons 🌐 English βš– 247 KB

Diffusion barrier materials, TiN and WN, were deposited by atomic layer deposition (ALD). The chlorine concentration of the TiN film was as low as 1.2 at.-%, and resistivity was below 200 lX cm. Ultra high aspect ratio (AR = 85) trenches were used to assess step coverage. Tungsten nitride film, depo