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Comment on “Volume and surface self-diffusion measurements on copper by thermal surface smoothing” by K. Hoehne and R. Sizmann

✍ Scribed by Bonzel, H. P. ;Gjostein, N. A.


Book ID
105367968
Publisher
John Wiley and Sons
Year
1972
Tongue
English
Weight
209 KB
Volume
14
Category
Article
ISSN
0031-8965

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