Versatile low temperature wafer bonding and bond strength measurement by a blister test method

✍ Scribed by Alexander Doll; Martin Rabold; Frank Goldschmidtböing; Peter Woias

• Book ID: 106184819
• Publisher: Springer-Verlag
• Year: 2005
• Tongue: English
• Weight: 672 KB
• Volume: 12
• Category: Article
• ISSN: 0946-7076
• DOI: 10.1007/s00542-005-0030-x