✦ LIBER ✦
A versatile and flexible low-temperature full-wafer bonding process of monolithic 3D microfluidic structures in SU-8
✍ Scribed by Steigert, J; Brett, O; Müller, C; Strasser, M; Wangler, N; Reinecke, H; Daub, M; Zengerle, R
- Book ID
- 127365695
- Publisher
- Institute of Physics
- Year
- 2008
- Tongue
- English
- Weight
- 640 KB
- Volume
- 18
- Category
- Article
- ISSN
- 0960-1317
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