Control of Carrier Density by a Solution
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T. Takenobu; T. Kanbara; N. Akima; T. Takahashi; M. Shiraishi; K. Tsukagoshi; H.
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Article
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2005
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John Wiley and Sons
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English
⚖ 858 KB
∼ 0.1 lm 3 nC -1 , compared to ∼ 0.15 lm 3 nC -1 in silicon. Greatly increased FIB etch rates could be achieved with water-vapor assistance. Thermal Annealing: The intermediate and final annealings were performed in a furnace, in a controlled atmosphere. The intermediate annealing was at 550 °C for