Reliability assessment of beam-lead seal
✦ LIBER ✦
Vapor condensation soldering of external leads to thin-film hybrid integrated circuits : L. W. Condra. Proc. Electron. Components Conf. Arlington, Va., (May 16–18 1977). p. 135
- Publisher
- Elsevier Science
- Year
- 1978
- Tongue
- English
- Weight
- 127 KB
- Volume
- 17
- Category
- Article
- ISSN
- 0026-2714
No coin nor oath required. For personal study only.
📜 SIMILAR VOLUMES
Solder dissolution rates of evaporated a
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Article
📅
1978
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Elsevier Science
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English
⚖ 131 KB