## Abstract Thermal curing of adhesive films was investigated to facilitate the fabrication of a reliable bonding for semiconductors. The formulated adhesive films contained acrylic polymer, epoxy resins, phenol resin, and an imidazole derivative that was the catalyst for curing the epoxy resins wi
β¦ LIBER β¦
UV/heat dual-curable adhesive tapes for fabricating stacked packages of semiconductors
β Scribed by Naoya Saiki; Osamu Yamazaki; Kazuyoshi Ebe
- Publisher
- John Wiley and Sons
- Year
- 2008
- Tongue
- English
- Weight
- 178 KB
- Volume
- 108
- Category
- Article
- ISSN
- 0021-8995
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## Abstract In an attempt to control the adhesive properties of acrylic copolymerβbased pressureβsensitive adhesives, a series of multifunctional acrylate monomers were added and UV cured. The adhesive compound with a difunctional monomer had increased peel strength after UV curing. On the other ha