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UV/heat dual-curable adhesive tapes for fabricating stacked packages of semiconductors

✍ Scribed by Naoya Saiki; Osamu Yamazaki; Kazuyoshi Ebe


Publisher
John Wiley and Sons
Year
2008
Tongue
English
Weight
178 KB
Volume
108
Category
Article
ISSN
0021-8995

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## Abstract Thermal curing of adhesive films was investigated to facilitate the fabrication of a reliable bonding for semiconductors. The formulated adhesive films contained acrylic polymer, epoxy resins, phenol resin, and an imidazole derivative that was the catalyst for curing the epoxy resins wi

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## Abstract In an attempt to control the adhesive properties of acrylic copolymer‐based pressure‐sensitive adhesives, a series of multifunctional acrylate monomers were added and UV cured. The adhesive compound with a difunctional monomer had increased peel strength after UV curing. On the other ha