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UV curable pressure-sensitive adhesives for fabricating semiconductors. I. Development of easily peelable dicing tapes

✍ Scribed by Kazuyoshi Ebe; Hideo Seno; Katsuhiko Horigome


Publisher
John Wiley and Sons
Year
2003
Tongue
English
Weight
247 KB
Volume
90
Category
Article
ISSN
0021-8995

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UV curable pressure-sensitive adhesives
✍ Katsuhiko Horigome; Kazuyoshi Ebe; Shin-ichi Kuroda 📂 Article 📅 2004 🏛 John Wiley and Sons 🌐 English ⚖ 90 KB 👁 2 views

## Abstract In an attempt to control the adhesive properties of acrylic copolymer‐based pressure‐sensitive adhesives, a series of multifunctional acrylate monomers were added and UV cured. The adhesive compound with a difunctional monomer had increased peel strength after UV curing. On the other ha