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Use of amorphous carbon-encapsulated copper nanoparticles in thermal conducting fluids

✍ Scribed by Jin-shan Pang; Hai-ye Zhang; Li-ping Li; Qi-guang Wu; Jin Lin

Book ID: 113514631
Publisher: Elsevier Science
Year: 2012
Tongue: English
Weight: 37 KB
Volume: 50
Category: Article
ISSN: 0008-6223
DOI: 10.1016/j.carbon.2012.04.020

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