Enhanced thermal conductivity and viscosity of copper nanoparticles in ethylene glycol nanofluid

✍ Scribed by Garg, J.; Poudel, B.; Chiesa, M.; Gordon, J. B.; Ma, J. J.; Wang, J. B.; Ren, Z. F.; Kang, Y. T.; Ohtani, H.; Nanda, J.; McKinley, G. H.; Chen, G.

• Book ID: 118025914
• Publisher: American Institute of Physics
• Year: 2008
• Tongue: English
• Weight: 581 KB
• Volume: 103
• Category: Article
• ISSN: 0021-8979
• DOI: 10.1063/1.2902483