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Use of a PECVD–PVD process for the deposition of copper containing organosilicon thin films on steel

✍ Scribed by A. Daniel; C. Le Pen; C. Archambeau; F. Reniers


Book ID
108063970
Publisher
Elsevier Science
Year
2009
Tongue
English
Weight
263 KB
Volume
256
Category
Article
ISSN
0169-4332

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