Understanding the Impact of Inductance in Carbon Nanotube Bundles for VLSI Interconnect Using Scalable Modeling Techniques

✍ Scribed by Nieuwoudt, Arthur; Massoud, Yehia

• Book ID: 121688914
• Publisher: IEEE
• Year: 2006
• Tongue: English
• Weight: 944 KB
• Volume: 5
• Category: Article
• ISSN: 1536-125X
• DOI: 10.1109/tnano.2006.883480