Evaluating the impact of resistance in carbon nanotube bundles for VLSI interconnect using diameter-dependent modeling techniques

✍ Scribed by Nieuwoudt, A.; Massoud, Y.

• Book ID: 114618427
• Publisher: IEEE
• Year: 2006
• Tongue: English
• Weight: 945 KB
• Volume: 53
• Category: Article
• ISSN: 0018-9383
• DOI: 10.1109/ted.2006.882035