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Ultrathin amorphous Ni–Ti film as diffusion barrier for Cu interconnection

✍ Scribed by B.T. Liu; L. Yang; X.H. Li; K.M. Wang; Z. Guo; J.H. Chen; M. Li; D.Y. Zhao; Q.X. Zhao; X.Y. Zhang

No coin nor oath required. For personal study only.

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