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Ultra-thin Chip Technology and Applications || Ultra-thin Wafer Fabrication Through Dicing-by-Thinning

โœ Scribed by Burghartz, Joachim

Book ID
121424739
Publisher
Springer New York
Year
2010
Tongue
English
Weight
294 KB
Edition
2011
Category
Article
ISBN
1441972765

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โœฆ Synopsis

Ultra-thin chips are the "smart skin" of a conventional silicon chip. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, Microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips.

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