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Trench gap-filling copper by ion beam sputter deposition

โœ Scribed by Sheng Han; Tzu-Li Lee; Ching-Jung Yang; Han C. Shih


Book ID
113781485
Publisher
Elsevier Science
Year
2006
Tongue
English
Weight
295 KB
Volume
97
Category
Article
ISSN
0254-0584

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