✦ LIBER ✦

Transient thermal strain measurements in electronic packages

✍ Scribed by Bastawros, A.F.; Voloshin, A.S.

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE InterSociety Conference on Thermal

✍ Bastawros, A.F.; Voloshin, A.S. 📂 Article 📅 1990 🏛 IEEE ⚖ 821 KB

Package hermeticity testing with thermal

✍ András Vass-Várnai; Márta Rencz 📂 Article 📅 2009 🏛 Springer-Verlag 🌐 English ⚖ 405 KB

Evaluation of thermal deformation in ele

✍ Beom, Hyeon Gyu ;Jeong, Kyoung Moon 📂 Article 📅 2000 🏛 Springer-Verlag 🌐 Korean ⚖ 793 KB

Modeling and transient simulation of pla

✍ Nanju Na; Jinseong Choi; Sungjun Chun; Madhavan Swaminathan; Jegannathan Sriniva 📂 Article 📅 2000 🏛 IEEE 🌐 English ⚖ 356 KB

Quantification of thermal contact conduc

✍ Childres, W.S.; Peterson, G.P. 📂 Article 📅 1989 🏛 IEEE 🌐 English ⚖ 574 KB

EVALUATION OF A FULL-BRIDGE E.R. STRAIN

✍ E. PROCTER; D. H. MITCHELL 📂 Article 📅 1968 🏛 John Wiley and Sons 🌐 English ⚖ 487 KB