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Transient thermal and hydrodynamic model of flat heat pipe for the cooling of electronics components

✍ Scribed by R. Sonan; S. Harmand; J. Pellé; D. Leger; M. Fakès

Book ID: 108141429
Publisher: Elsevier Science
Year: 2008
Tongue: English
Weight: 808 KB
Volume: 51
Category: Article
ISSN: 0017-9310
DOI: 10.1016/j.ijheatmasstransfer.2008.04.071

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