Coupled thermal and hydrodynamic models of flat micro heat pipes for the cooling of multiple electronic components

✍ Scribed by F. Lefèvre; M. Lallemand

• Book ID: 108141084
• Publisher: Elsevier Science
• Year: 2006
• Tongue: English
• Weight: 322 KB
• Volume: 49
• Category: Article
• ISSN: 0017-9310
• DOI: 10.1016/j.ijheatmasstransfer.2005.10.001