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Transient liquid phase (tlp) diffusion bonding of Ti45Ni49Cu6P/M components using Cu interlayer

✍ Scribed by Haluk Kejanli; Mustafa Taşkin; Sedat Kolukisa; Polat Topuz


Publisher
Springer
Year
2008
Tongue
English
Weight
337 KB
Volume
44
Category
Article
ISSN
0268-3768

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