Half-transient liquid phase diffusion welding: An approach for diffusion welding of SiCp/A356 with Cu interlayer

✍ Scribed by Meng Hua; Wei Guo; Hang Wai Law; John Kin Lim Ho

• Publisher: Springer
• Year: 2007
• Tongue: English
• Weight: 550 KB
• Volume: 37
• Category: Article
• ISSN: 0268-3768
• DOI: 10.1007/s00170-007-0983-2