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Transient heat transfer to liquid helium from bare copper surfaces in a vertical orientation — I: Film boiling regime

✍ Scribed by Y. Iwasa; B.A. Apgar


Publisher
Elsevier Science
Year
1978
Tongue
English
Weight
789 KB
Volume
18
Category
Article
ISSN
0011-2275

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Heat transfer characteristics of a copper plate (18 mm x 76 mm) to liquid helium have been measured by changing the orientation and treatment of the heat transfer surface. The treated heat transfer surfaces were (a) the polished Cu surface, (b) the oxidized Cu surface and (cl, (d) the Cu surface oxi