Dependence of heat transfer from a wide copper plate to liquid helium on heat transfer surface orientation and treatment

✍ Scribed by Akifumi Iwamoto; Toshiyuki Mito; Kazuya Takahata; Nagato Yanagi; Junya Yamamoto

• Publisher: Elsevier Science
• Year: 1996
• Tongue: English
• Weight: 671 KB
• Volume: 36
• Category: Article
• ISSN: 0011-2275
• DOI: 10.1016/0011-2275(96)81601-8

✦ Synopsis

Heat transfer characteristics of a copper plate (18 mm x 76 mm) to liquid helium have been measured by changing the orientation and treatment of the heat transfer surface. The treated heat transfer surfaces were (a) the polished Cu surface, (b) the oxidized Cu surface and (cl, (d) the Cu surface oxidized 50% of area. We observed that the critical heat flux depends upon the heat transfer surface orientation, and the critical heat flux has its maximum between 0" and 30" of the surface orientation, where the angle is taken from the horizontal axis. On the other hand, the minimum heat flux has less dependence on the heat surface orientation. The critical heat fluxes of the 50% oxidized surfaces almost agree with that of the polished Cu surface. The minimum heat fluxes of the 50% oxidized Cu surfaces approximately agree with that of the 100% oxidized Cu surface.