Toughening of Ti3SiC2 with 3Y-TZP addition by spark plasma sintering
β Scribed by Sui Lin Shi; Wei Pan
- Publisher
- Elsevier Science
- Year
- 2007
- Tongue
- English
- Weight
- 605 KB
- Volume
- 447
- Category
- Article
- ISSN
- 0921-5093
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π SIMILAR VOLUMES
Ti 3 SiC 2 bulk materials were synthesized from the starting powders of 1Ti/1Si/2TiC-xAl and 3Ti/1SiC/1C-xAl (molar ratios, x ranges from 0.05 to 0.15) at temperatures between 1100 and 1400 β’ C for 15 min by pulse discharge sintering technique. X-ray diffraction and scanning electron microscopy were
film and the substrate is increased. Due to electrodeposited a-CNPs have good adhesion to the Si substrate , the adhesion between the a-CNP/GNS composite film and the Si substrate can be enhanced remarkably in this study. The simultaneous electrodeposition is a simple and efficient approach to prep