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Three-dimensional simulation of microstructure evolution in damascene interconnects: Effect of overburden thickness

✍ Scribed by Jung-Kyu Jung; Nong-Moon Hwang; Young-Joon Park; Young-Chang Joo


Book ID
107453362
Publisher
Springer US
Year
2005
Tongue
English
Weight
322 KB
Volume
34
Category
Article
ISSN
0361-5235

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