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Numerical simulation and experimental verification of microstructure evolution in a three-dimensional hot upsetting process

✍ Scribed by Yong-Cheng Lin; Ming-Song Chen

Book ID: 108178973
Publisher: Elsevier Science
Year: 2009
Tongue: English
Weight: 692 KB
Volume: 209
Category: Article
ISSN: 0924-0136
DOI: 10.1016/j.jmatprotec.2008.10.036

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