Three-dimensional integrated circuits implementation of multiple applications emphasising manufacture reuse

✍ Scribed by Hung, C.-M.; Lin, Y.-L.

• Book ID: 117809910
• Publisher: The Institution of Engineering and Technology
• Year: 2011
• Tongue: English
• Weight: 522 KB
• Volume: 5
• Category: Article
• ISSN: 1751-8601
• DOI: 10.1049/iet-cdt.2009.0118