✦ LIBER ✦
Thermal-electrical co-optimisation of floorplanning of three-dimensional integrated circuits under manufacturing and physical design constraints
✍ Scribed by Jain, A.; Alam, S.M.; Pozder, S.; Jones, R.E.
- Book ID
- 117809906
- Publisher
- The Institution of Engineering and Technology
- Year
- 2011
- Tongue
- English
- Weight
- 990 KB
- Volume
- 5
- Category
- Article
- ISSN
- 1751-8601
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